Apparatus and method for dissipating heat with microelectromechanical system

ABSTRACT

In one or more embodiments, an apparatus generally comprises a microelectromechanical system (MEMS) module comprising a plurality of air movement cells and a power unit operable to control the plurality of air movement cells, and a housing configured for slidably receiving the MEMS module and positioning the MEMS module adjacent to a heat generating component of a network device. The MEMS module is operable to dissipate heat from the heat generating component and is configured for online installation and removal during operation of the heat generating component.

STATEMENT OF RELATED APPLICATIONS

The present application is a divisional of U.S. application Ser. No.17/064,570, filed Oct. 6, 2020, which claims priority from U.S.Provisional Applications No. 63/012,845 entitled HEAT DISSIPATION FORCOOLING HIGH POWER OPTICAL MODULES, filed on Apr. 20, 2020 and U.S.Provisional Application No. 63/013,488 entitled HEAT DISSIPATION FORCOOLING ACCESS POINT COMPONENTS, filed on Apr. 21, 2020. The contents ofthese provisional applications are incorporated herein by reference intheir entirety.

TECHNICAL FIELD

The present disclosure relates generally to cooling network devicecomponents, and more particularly, to the use of microelectromechanicalsystems (MEMS) for cooling components such as optical modules or accesspoint components.

BACKGROUND

Over the past several years, there has been a tremendous increase in theneed for higher performance communications networks. Increasedperformance requirements have led to an increase in energy use resultingin greater heat generation from network device components. Traditionalcooling methods may be inadequate for these increased performancecomponents, which typically have limited space for cooling.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a top view of a microelectromechanical system (MEMS) block,in accordance with one embodiment.

FIG. 1B is a bottom view of the MEMS block shown in FIG. 1A.

FIG. 1C is a top perspective of the MEMS block of FIG. 1A coupled to apower module, in accordance with one embodiment.

FIG. 1D is a bottom perspective of a MEMS module of FIG. 1C.

FIG. 2 is a block diagram of the power unit, in accordance with oneembodiment.

FIG. 3 is a perspective of the MEMS module of FIG. 1C, an opticalmodule, and optical module cage, in accordance with one embodiment.

FIG. 4 is a perspective of the MEMS module and optical module of FIG. 3inserted into the optical module cage.

FIG. 5 is a perspective of a stacked optical module cage with openingsfor receiving optical modules and MEMS modules, in accordance with oneembodiment.

FIG. 6A is a perspective of a MEMS block and power unit, in accordancewith one embodiment.

FIG. 6B is a perspective of the MEMS block and power unit of FIG. 6Aintegrated with an optical module, in accordance with one embodiment.

FIG. 7 is a perspective of an optical module cage for receiving theoptical module with integrated MEMS module, in accordance with oneembodiment.

FIG. 8 is a perspective of the optical module with integrated MEMSmodule of FIG. 6B inserted into the optical module cage of FIG. 7 .

FIG. 9 is a perspective of a stacked optical module cage for receivingoptical modules with integrated MEMS modules, in accordance with oneembodiment.

FIG. 10 is a block diagram of an access point comprising a plurality ofMEMS modules for cooling components of the access point, in accordancewith one embodiment.

FIG. 11 illustrates the access point in a millimeter wave (mmWave)network, in accordance with one embodiment.

FIG. 12 is a flowchart illustrating an overview of a process for coolingwith the removable MEMS module, in accordance with one embodiment.

Corresponding reference characters indicate corresponding partsthroughout the several views of the drawings.

DESCRIPTION OF EXAMPLE EMBODIMENTS

Overview

In one embodiment, an apparatus generally comprises amicroelectromechanical system (MEMS) module comprising a plurality ofair movement cells and a power unit operable to control the plurality ofair movement cells, and a housing configured for slidably receiving theMEMS module and positioning the MEMS module adjacent to a heatgenerating component of a network device. The MEMS module is operable todissipate heat from the heat generating component and is configured foronline installation and removal during operation of the heat generatingcomponent.

In another embodiment, an apparatus generally comprises amicroelectromechanical system (MEMS) module comprising a plurality ofair movement cells and a power unit operable to control the plurality ofair movement cells, and an optical module. The MEMS module is mounted onthe optical module for insertion with the optical module into an opticalmodule cage and is operable to dissipate heat from the optical module.

In yet another embodiment, a method generally comprises controlling at apower unit, a plurality of air movement cells in amicroelectromechanical system (MEMS) module to cool a heat generatingcomponent positioned adjacent to the MEMS module, receiving anindication of removal of the MEMS module, monitoring a temperature atthe heat generating component, and modifying an operating mode of theheat generating component upon the temperature exceeding a predeterminedlimit.

Further understanding of the features and advantages of the embodimentsdescribed herein may be realized by reference to the remaining portionsof the specification and the attached drawings.

EXAMPLE EMBODIMENTS

The following description is presented to enable one of ordinary skillin the art to make and use the embodiments. Descriptions of specificembodiments and applications are provided only as examples, and variousmodifications will be readily apparent to those skilled in the art. Thegeneral principles described herein may be applied to other applicationswithout departing from the scope of the embodiments. Thus, theembodiments are not to be limited to those shown, but are to be accordedthe widest scope consistent with the principles and features describedherein. For purpose of clarity, details relating to technical materialthat is known in the technical fields related to the embodiments havenot been described in detail.

Over the past several years, there has been a tremendous increase in theneed for higher performance communications networks, which has led to anincrease in energy use resulting in greater heat generation at networkdevice components, including for example, optical modules and accesspoint (AP) components.

In order to satisfy the increasing demand of bandwidth and speed,optical modules (pluggable transceiver modules) are being used in linecards on various network devices (e.g., switches, routers, etc.).Optical modules come in many different form factors such as SFP (SmallForm-Factor Pluggable), QSFP (Quad Small Form-Factor Pluggable), QSFP+,QSFP-DD (QSFP Double Density), OSFP (Octal Small Form-Factor Pluggable),and the like, and may support data rates up to 400 Gb/s (or higher), forexample. The optical modules operate as an engine that convertselectrical signals to optical signals or in general as the interface tothe network element copper wire or optical fiber. Hosts for thesepluggable modules include line cards used on switches, routers, edgeproducts, and other network devices. In conventional systems, cooling ofoptical modules for advanced Ethernet speeds typically requires liquidcooling for higher power applications or lower power applications indense implementations.

Access points are often limited in power, size, and weight. Due to theselimitations, heatsinks are typically not used. Limited cooling, alongwith power, size, and weight restrictions, make it difficult to addfunctionality such as an offload engine, radar processing functions, orUSB-C connections to conventional access points.

The embodiments described herein implement microelectromechanicalsystems (MEMS) to drive airflow through (over, under, past) a networkdevice component (e.g., optical (optics) module such as QSFP-DD or otherform factor, offload engines such as radar systems or other operationintensive components in an access point, or other heat generatingcomponent). In one or more embodiments, a MEMS module (MEMS coolingtray, module MEMS) is removably positioned adjacent to the networkdevice component to pull air across the component. In one or moreembodiments, an OIR (Online Installation and Removal) system allows forremoval and replacement of the MEMS module without impacting systemoperation. In one or more embodiments, a Pulse Width Modulation (PWM)power unit provides granular control of the MEMS module.

The term “heat generating component” as used herein may refer to anyelectrical, optical, or electrical/optical device or circuitry (e.g.,high power component, increased performance component) in which heatdissipation capability of the component is insufficient to moderate itstemperature, including for example, optical modules, offload processingengines, AP components, or other devices that generate excess heat andthus need thermal management to prevent failure and improve reliability.

In one or more embodiments, a MEMS module may be integrated with anoptical module and inserted into an optical module cage. In one or moreembodiments, the optical module cage is a stacked configuration toaccommodate multiple optical modules, MEMS modules (cooling trays), orintegrated optical modules and MEMS modules. In one or more embodiments,the MEMS module is operable to remove dissipated heat from 20 Watts toover 80 Watts optical module applications (e.g., QSFP-DD or other formfactor). In one example, MEMS cooling may be used to maintain acomponent temperature of less than 74° C. without the use of liquidcooling.

In one or more embodiments, the MEMS module may be used to cool offloadengines such as radar systems, video conference applications (e.g.,WebEx), or other components without the use of heatsinks. In one or moreembodiments, the MEMS cooling provides for replacement of key functionswithout additional module height that is needed for heatsinks. In one ormore embodiments, the MEMS cooling provides for AP operation with fourtimes the power of a conventional AP with minimal weight increase. Forexample, in one or more embodiments, MEMS cooling may be used todissipate over 90 watt PoE (Power over Ethernet) in an AP withoutheatsinks or the need to create a larger size AP. In another example,MEMS cooling may be used to cool 90 watt USB-C systems. In one or moreembodiments, MEMS cooling may be used to dissipate more than 100 wattsusing FMP (Fault Managed Power)/ESP (Extended Safe Power), as describedin U.S. patent application Ser. No. 16/805,580 (“Multi-Phase Pulse PowerShort Reach Distribution”), filed Feb. 28, 2020, which is incorporatedherein by reference in its entirety.

The embodiments described herein operate in the context of a datacommunications network including multiple network devices. The networkmay include any number of network devices in communication via anynumber of nodes (e.g., routers, switches, gateways, controllers, edgedevices, access devices, aggregation devices, core nodes, intermediatenodes, power sourcing equipment, powered devices, or other networkdevices), which facilitate passage of data within the network. One ormore of the network devices may comprise one or more optical modulescooled by MEMS cooling described herein with respect to FIGS. 3-9 . Thenetwork device may further include any combination of memory,processors, power supply units, and network interfaces. The networkinterface may comprise any number of interfaces (line cards, ports) forreceiving data or transmitting data to other devices. The networkinterface may include, for example, an optical interface at an opticalmodule. In one or more embodiments, the network device comprises anaccess point in a wireless network. One or more components of the accesspoint may be cooled by the MEMS cooling as described herein with respectto FIGS. 10-11 .

Referring now to the drawings, and first to FIGS. 1A-1D, a MEMS block(device, element, array) 10 that may be used to dissipate heat from aheat generating component (e.g., optical module, access point component)of a network device (e.g., switch, router, line card or fabric cardinstalled in switch or router, access point, server) is shown, inaccordance with one embodiment. FIG. 1A is front view showing aplurality of exhaust ports (air exhaust) 12 and FIG. 1B is a rear viewshowing a plurality of air inlet ports (air entrance) 14. FIGS. 1C and1D are top and bottom perspectives, respectively, of the MEMS block 10shown in FIGS. 1A and 1B with a power unit (e.g., PWM (Pulse WidthModulation) power module) 16 coupled to the MEMS block 10. The MEMSblock 10 and power unit 16 are referred to herein as a MEMS module 15.

It should be noted that the terms lower, upper, bottom, top, below,front, rear, above, horizontal, vertical, and the like, which may beused herein are relative terms dependent upon the orientation of thenetwork device and components and should not be interpreted in alimiting manner. These terms describe points of reference and do notlimit the embodiments to any particular orientation or configuration.

In one or more embodiments, an apparatus comprises the MEMS module 15comprising a plurality of air movement cells 19 a (FIG. 1C) and a powerunit 16 operable to control the plurality of air movement cells, and ahousing (e.g., optical module cage, access point) configured forslidably receiving the MEMS module 15 and positioning the MEMS moduleadjacent to the heat generating component of the network device. TheMEMS module 15 is operable to dissipate heat from the heat generatingcomponent and is configured for online installation and removal duringoperation of the heat generating component.

As described below, the MEMS module 15 (also referred to a MEMS coolingtray) may be slidably inserted into and removed from the network deviceat a location immediately adjacent to the heat generating component todissipate heat using MEMS technology. The MEMS block 10 transfers heatgenerated by the component where heat dissipation capability of the heatgenerating component is insufficient to moderate its temperature.

The MEMS block 10 comprises any number of MEMS arrays (units) 19 (e.g.,1, 2, 3, 4, 5, 6 . . . ), which may be individually controlled by thepower unit 16 (FIG. 1A). Each MEMS array 19 may comprise one or more airmovement cells (heat dissipation cells, cooling cells) 19 a operable tocreate air pressure and air movement to dissipate heat away from theheat generating device, thereby providing cooling (FIG. 1C). Each airinlet 14 may provide air to any number of cells 19 a and each cell maydistribute air to one or more air exhaust 12, with the cells arranged inany format. In one example, the cell 19 a comprises a piezoelectricplate 19 b or other suitable structure (e.g., one or more diaphragms)electrically coupled to the power unit 16 to drive the piezoelectricplate upward and downward as indicated by dashed lines in the enlargedcutout view of FIG. 1C. The power unit 16 actuates the plate 19 b tovibrate between the positions shown in FIG. 1C. Vibration of the plate19 b pulls fluid (e.g., air) into the cell 19 a (at air inlet 14) anddrives fluid out of the cell (at air exhaust 12). The plate 19 b may beoperable to drive fluid from one side of the plate to the other (e.g.,permeable material, orifices). In one or more embodiments, a thin filmtemperature sensor may be used to provide control feedback for theindividual cells or groups of cells. The MEMS block 10 may comprise anynumber or type of MEMS cooling components in any arrangement.

In the example shown in FIGS. 1C and 1D, one end of the MEMS block 10comprises a status indicator 17 (e.g., LED (Light Emitting Diode)) andan OIR (Online Insertion and Removal) switch (button) 18. As describedbelow, the MEMS module 15 may be replaced independently from the opticalmodule (or other heat generating component) with an OIR method tocontrol replacement of the MEMS module. The power unit 16 is connectedto an opposite end of the MEMS block 10 and may provide granular controlof the MEMS block (e.g., individual cell/MEMS array/MEMS group control).As described below with respect to FIG. 2 , the power unit 16 mayinclude one or more power connections 11 (e.g., DC (Direct Current)power input) or data connections 13 (e.g., SPE (Single Pair Ethernet)connection). The power and data connections 11, 13 may be located on oneor both sides of the power unit 16 or along an edge of the power unit.

FIG. 2 is block diagram illustrating a circuit, generally indicated at20, of the power unit 16 (FIGS. 1C and 1D), in accordance with oneembodiment. In the example shown in FIG. 2 , the power unit comprises aPWM (Pulse Width Modulation) power module comprising a power filter 21,a step-down device (DC-DC step-down converter) 22, a microprocessor (μP)23, and a PWM controller 24. The power unit may receive, for example, 12VDC (or other IBV (Intermediate Bus Voltage)) at the power filter 21.The power is transmitted to the microprocessor 23 and PWM controller 24after passing through the step-down device 22. In addition to receivingthe power, the microprocessor 23 communicates over SPE (Single PairEthernet), or other suitable communications protocol at block 25. In oneor more embodiments, the power unit may also be configured for MDIO(Management Data Input/Output) or I2C (Inter-Integrated Circuit)). Asshown in FIG. 2 , the PWM controller 24 may provide a MEMS fail signalto the microprocessor 23 based on monitoring of each MEMS unit (e.g.,through one or more sense resistors R). For example, the PWM controller24 may include a current sense to monitor for a MEMS failure, therebyallowing the microprocessor 23 to communicate status to system softwareusing SPE. The PWM controller 24 controls operation of any number ofMEMS units (and cooling/air movement cells) (MEMS₁ . . . MEMS_(N)). Inone example, the PWM power unit may be configured to provide pulse DC ata frequency of 20 kHz to 100 kHz. The frequency range may beprogrammable.

The microprocessor 23 also receives input from the OIR switch 18, whichmay be actuated prior to removal of the MEMS module 15, and provides anoutput signal to the LED indicator 17 when it is safe to remove the MEMSmodule (FIGS. 1C and 2 ). For example, upon receiving an OIR signal, thePWM controller 24 may flash the LED when it is safe to remove the MEMSmodule 15. The microprocessor 23 also receives a signal from atemperature monitor at (e.g., on or near) the heat generating component,which may be used to indicate if the component is below a specifiedtemperature so that the microprocessor 23 can send a signal to the LEDindicator to indicate that it is safe to remove the MEMS module. Whenthe MEMS module 15 is removed, the heat generating component is withoutair flow. The temperature monitor may be used to indicate if thetemperature at the heat generating component has exceeded a predefinedlimit during OIR of the MEMS module, in which case the controller (or acontroller at the network device) may modify an operating condition ofthe heat generating component (e.g., reduce power, turn off) to preventdamage to the component. Once the MEMS module is inserted and thetemperature has lowered to an acceptable level, the heat generatingcomponent may resume normal operation. During normal operation, the PWMcontroller 24 may monitor the temperature and adjust airflow as needed.For example, the MEMS module 15 (or one or more MEMS units) may bepowered down during periods of lower operating temperature. It is to beunderstood that the circuit 20 shown in FIG. 2 is only an example andchanges may be made to the number, type, or arrangement of components atthe power unit without departing from the scope of the embodiments.

FIG. 3 shows the MEMS module 15, an optical module 30, and opticalmodule cage 32, in accordance with one embodiment. The optical modulecage 32 (housing, structure) is configured for receiving the opticalmodule 30 (pluggable module, optics modules, pluggable optical module,optical transceiver (e.g., SFP, OSFP, QSFP, QSFP+, QSFP-DD, and thelike)).

As shown in FIG. 3 , the optical module cage 32 comprises a first(lower) opening 34 for receiving the optical module 30 and a second(upper) opening for receiving the MEMS module (MEMS cooling tray) 15.The MEMS module 15 is configured to be slidably inserted into or removedfrom the optical module cage 32 to provide an OIR function, aspreviously described. An upper surface 31 of the optical module cage 32may be open or include a plurality of openings to allow air flow fromthe air exhaust 12 at the MEMS module 15 from the optical module cage.

The optical module cage comprises a connector (interface) for connectingthe optical module with electronic components on a line card or otherelectronic component operable to utilize transceivers and interface witha telecommunications network. The optical module cage may be configuredwith a high speed connector and power connector. In one or moreembodiments, the optical module cage 32 may be located within a linecard or fabric card. The optical modules are coupled to electroniccomponents (e.g., one or more integrated circuit cards mounted on one ormore circuit boards along with supporting components). The electroniccomponents and circuits may be operable to interface telecommunicationlines (e.g., copper wire, optical fibers) in a telecommunicationsnetwork. The line card may be configured to perform one or moreoperations and receive any number or type of pluggable transceivermodules configured for transmitting and receiving signals, and may beconfigured for operation in any type of chassis or network device.

The optical module 30 comprises two front connectors 38 (e.g., LC oranother suitable connector). The other end comprises an optical modulecage interface 39. The pluggable optical module 30 may be configured tosupport gigabit Ethernet, Fibre Channel, or other communicationstandards.

In one or more embodiments, the optical module 30 may include raisedribs (fins) 36 located along an upper surface at one end of the opticalmodule, which extends from the optical module cage and remains externalto the cage. A portion of the optical module that is inserted into theoptical module cage 32 may include slightly raised ribs 34, with aprofile that fits within the optical module cage 34. The ribs define aplurality of air flow channels.

FIG. 4 is a perspective illustrating the MEMS module 15 and opticalmodule 30 inserted into the optical module cage 32. As indicated by thearrows in FIG. 4 , air flow enters through the airflow channels definedby the ribs 36, passes through the MEMS module 15, and exits from thetop of the optical module cage 32. Cool air entering through the airflowchannels is pulled into the air inlet 14 of the MEMS module 15 and hotair exits through the air exhaust 12, thereby dissipating heat generatedby the optical module 30 (FIGS. 1C, 1D and 4 ). As previously described,the MEMS module 15 creates air pressure and movement to dissipate heatfrom the high power optical module 30. The optical module cage 32 mayinclude any number of openings in an upper surface to allow for airflow, as described below with respect to FIGS. 7 and 8 .

FIG. 5 shows a dual optical module cage 50, in accordance with oneembodiment. The dual optical module cage 50 includes two optical moduleopenings 54 a, 54 b and two MEMS module (MEMS cooling tray) openings 55a, 55 b. The optical module cage 50 is shown mounted on a printedcircuit board (PCB) 58 with a cut-out 59 for receiving the dual opticalmodule cage 50. The PCB cut-out 59 provides for low profile mounting andallows two optical modules to be cooled at a maximum dissipation rate.In this example, the MEMS modules are positioned above and below theoptical modules. Air flow for the first (upper) optical module exitsfrom the top side and air flow for the second (lower) optical moduleexits from the bottom side of the printed circuit board 58.

The optical module cage may include any number of openings for receivingoptical modules in a stacked or side-by-side arrangement (e.g., 2×1 (tworows with one module in each row) (stacked) (as shown in FIG. 5 ), 1×2(1 row with two modules) (side-by-side), 2×2 (two rows, two modules inreach row), 2×4 (two rows, four modules in each row), etc.). Eachoptical module cage opening in the optical module cage may be configuredwith an adjacent opening for insertion of the MEMS module 15 adjacent tothe optical module, or only some of the openings may be configured foruse with the MEMS module (e.g., no MEMS module for lower power opticalmodules).

The term “stacked” as used herein refers to one module positioned in alocation vertically above another module and the term “side-by-side” asused herein refers to two modules positioned horizontally adjacent toone another. As previously noted, the terms above/below, upper/lower,top/bottom, horizontal/vertical, or front/rear as used herein arerelative to the position of the cage and also cover other orientationsof the cage. Thus, the terms are used only for ease of description andare not to be interpreted as limiting the arrangement of openings orcomponents within an optical module cage.

FIG. 6A is a perspective of a MEMS module configured for integrationwith an optical module. As shown in FIG. 6A, the MEMS module comprises aMEMS block 60 comprising a plurality of openings 62 defining an airexhaust and air inlets 64 formed within an edge and one or both sides ofthe MEMS block 60. The MEMS block further includes an indicator (LEDindicator) 67 and OIR switch (button) 68. In this example, the LEDindicator 67 is located on a front edge margin of an upper surface ofthe MEMS block 60. A power unit 66 comprises power inputs 61 and one ormore data connection (e.g., SPE interface) (not shown).

FIG. 6B shows the MEMS module (MEMS block 60 and power unit 66)integrated with an optical module 69, in accordance with one embodiment.In this example, the power unit 66 is mounted on the optical module,offset from the MEMS block 60, however, it may also be mounted inlinewith the MEMS block as previously described. The MEMS block 60 mayinclude any number of air inlets 64. In the example shown in FIGS. 6Aand 6B, the air inlets 64 are positioned towards a front of the MEMSblock 60 to receive air flow at the open end of the optical module cage,as described below with respect to FIG. 8 . The optical module includesoptical connectors 63 (e.g., LC connectors) and optical module cageinterface (electrical connector) 65.

FIG. 7 is a perspective of an optical module cage 70 for receiving theoptical module with integrated MEMS module shown in FIG. 6B. In theexample shown in FIG. 7 , the optical module cage includes a pluralityof air flow openings 74 in an upper surface of the optical module cagefor flow of hot air exiting the MEMS block. The optical module withintegrated MEMS module is inserted into opening 76 as shown in FIG. 8 .A plurality of side air inlets 75 (two on each side in the example shownin FIG. 7 ) are formed on one or more sides of the optical module cagefor additional air flow into the cage. There may be openings formed in aside wall of the optical module cage at the location of the side airinlets 75 or material may be removed from the optical module cage at thearea of the side air inlet tube.

FIG. 8 illustrates the optical module with integrated MEMS module ofFIG. 6B inserted into the optical module cage 70 of FIG. 7 . Air enterthrough openings 64 in the MEMS block 60 and air inlet tubes 75 on theoptical module cage 70 and exits from the MEMS block 60 at air exhaustopenings 62 and through an upper surface of the optical module cage atopenings 74.

In this example, the LED status indicator 67 is located on a top edge ofthe MEMS block 60, which extends from the optical cage 70 and istherefore viewable. The LED indicator 67 may be used to indicate afailure at the MEMS module, for example. The OIR button 68 is located ona front edge of the MEMS block 60 for ease of access. The OIR button maybe used to indicate an intent to remove the optical module with theintegrated MEMS module so that the microprocessor can communicate to thesystem software.

It is to be understood that the optical module with integrated MEMSmodule and optical module cage shown in FIG. 8 is only an example andchanges may be made without departing from the scope of the embodiments.For example, the air inlets or outlets on the MEMS block 60 or opticalmodule cage 70 may have a different size, shape, or location. Also, itis to be understood that the spacing between the MEMS block and aninternal surface of the optical module cage or shape and size of theoptical module or optical cage may be different than shown.

FIG. 9 illustrates an example of a stacked optical module cage 90 forreceiving two of the optical modules with integrated MEMS modules ofFIG. 6B in a stacked arrangement. In this example, the optical modulecage 90 comprises two openings 96 a, 96 b for receiving two opticalmodules with integrated MEMS modules. The dual optical module cage 90includes side air inlet tubes 95 for additional air flow. As previouslydescribed with respect to FIG. 5 , PCB 98 may include a cut-out 99 foradditional cooling. Air exits through an upper surface and lower surfaceof the optical module cage, which may include one or more openings forairflow. The optical cage 90 may be configured for receiving any numberof optical modules or optical modules with integrated MEMS modules inany arrangement.

It is to be understood that the configurations shown and described aboveare only examples and changes may be made without departing from thescope of the embodiments. The optical module and optical module cage maybe designed for compatibility with various optical form factorsincluding SFP, QSFP, OSFP, CFP, CFP2, CFP8, QSFP-DD, or any othercurrent or future form factor.

As previously noted, the heat generating component may also include acomponent of an access point. FIG. 10 is a block diagram of a higherpower access point 100 (e.g., 90 watts, >90 watts) with MEMS cooling, inaccordance with one embodiment. The AP may be configured formultigigabit (mGig) speeds. In one example, the AP is powered with 90watt PoE. In another example, the AP is powered with FMP/ESP. The MEMScooling system allows for advanced AP functions without the need forheatsinks, thereby providing a significant weight reduction. The AP 100comprises a plurality of replaceable modules and MEMS modules (coolingtrays, cooling elements) 110 (e.g., MEMS block 10 and power unit 16shown in FIG. 1C). The MEMS module 110 may rest on a CPU multi-core(e.g., two cores) offload engine, for example, or any other heatgenerating component. The MEMS module and components may be received ina housing as described above with respect to FIGS. 3, 5, 7, and 9 , forexample. In the example shown in FIG. 10 , multiple AP components arepositioned adjacent to the MEMS module 110 for dissipating heat from theAP components. In another example, more than one MEMS modules may beused to cool an offload engine (component) or more than one AP componentmay be cooled with the same MEMS module. In the example shown in FIG. 10, the AP components include an mmWave (millimeter Wave) offloadprocessing engine 101, a video conference offload processing engine 102,a Wi-Fi offload processing engine 103, a Bluetooth module 105, aPoE/FMP/ESP module 106, a pluggable optical module as previouslydescribed (e.g., QSFP, QSFP+, QSFP-DD, and the like) 107, a USB module108, and a Wi-Fi radio component 109. The offload engine is used tooffload processing from another device at the AP. An open slot 104 isalso shown for receiving another AP component.

It is to be understood that the components and arrangement of thecomponents and MEMS modules shown in FIG. 10 is only an example, and theaccess point 100 may include any number or type of components and MEMSmodules in any arrangement.

FIG. 11 shows an access point 111 (e.g., 90 watt AP) with mmWave(millimeter wave) and offload engines (e.g., WebEx, imaging) implementedwith the MEMS cooling system. The AP 111 is in communication with one ormore mmWave arrays (mm bar) 112 (three shown in FIG. 6 ), with eachmmWave array configured for a specified coverage (θ₁=θ₁+θ₂+θ₃). ThemmWave arrays 112 may be in communication with a USB 114 at the AP overa power and communications connection 116. The mm bars 112 may be incommunication over a USB connection 118, 119, for example. An offloadengine 113 (microprocessor/DSP (Digital Signal Processor)) is coupled tothe mmWave array 112 (e.g., USB connection, slidably inserted, pluggedin). The offload engine 113 includes a MEMS module 110 for cooling thecomponent. The AP may receive power from one or two 90 watt PoEconnections or an ESP source (100 watts or more). In one example, eachmm bar 112 may utilize about 8 watts. With a 90 watt budget, the systemmay include, for example, four mm bars 112, one microprocessor 113, andtwo cables for communications. The system may be configured, forexample, for 1G SPE with 45 watts or standard four pair 90 W PoE. Asshown in FIG. 11 , the AP may include any number of MEMS modules 110 forcooling any number of AP functions (components).

It is to be understood that the network shown in FIG. 11 is only anexample, and the network may have a different configuration with adifferent number or type of components or different power levels,without departing from the scope of the embodiments.

FIG. 12 is a flowchart illustrating an overview of a process for coolingheat generating components (e.g., optical modules, AP components) in anetwork device, in accordance with one embodiment. A MEMS cooling tray(e.g., MEMS module 15) comprising a plurality of air movement cells 19 ais inserted into a network device to cool a heat generating component(step 120) (FIGS. 1C and 12 ). A power unit controls the air movementcells to cool the heat generating component positioned adjacent to theMEMS module (step 121). In one or more embodiments, a controller at thepower unit may receive an OIR indication (e.g., OIR button 18 pushed) toindicate an intent to remove the MEMS module (step 122). The temperatureis monitored at the heat generating component (step 123) and in one ormore embodiments, an indication that the MEMS module is safe to removemay be provided. The MEMS module is then removed (step 124). If thetemperature exceeds a predetermined limit (step 125), an operating modeof the heat generating component may be modified (e.g., reduce power tocomponent, turn off component) (step 126). If the temperature staysabove the limit, the component remains off or in a reduced power state.If the MEMS module is reinserted (or a new MEMS module inserted) (step127) the MEMS module is used to cool the component (step 121). Thetemperature may continue to be monitored, and if the temperature fallsbelow the limit before the new MEMS module is inserted, the componentmay be turned back on.

It is to be understood that the process shown in FIG. 12 and describedabove is only an example and steps may be removed, added, modified, orcombined, without departing from the scope of the embodiments. Forexample, the temperature monitoring may be used to turn off one or moreMEMS modules or MEMS units if the temperature falls below a specifiedthreshold. In another example, the OIR switch may be removed and asensor used to indicate removal of the MEMS module.

Although the apparatus and method have been described in accordance withthe embodiments shown, one of ordinary skill in the art will readilyrecognize that there could be variations made to the embodiments withoutdeparting from the scope of the embodiments. Accordingly, it is intendedthat all matter contained in the above description and shown in theaccompanying drawings shall be interpreted as illustrative and not in alimiting sense.

What is claimed is:
 1. A method comprising: controlling at a power unit,a plurality of air movement cells in a microelectromechanical system(MEMS) module to cool a heat generating component positioned adjacent tothe MEMS module; and receiving an indication of removal of the MEMSmodule; monitoring a temperature at the heat generating component; andmodifying an operating mode of the heat generating component upon thetemperature exceeding a predetermined limit.
 2. The method of claim 1,wherein receiving an indication of removal of the MEMS module comprisesreceiving input from an online installation and removal switch andsignaling an indicator to provide an indication that is it safe toremove the MEMS module based on the temperature.
 3. The method of claim1, further comprising receiving power and SPE (Single Pair Ethernet) atthe power unit.
 4. The method of claim 1, wherein the power unitcomprises a pulse width modulation power controller operable toindividually control one or more of the air movement cells.
 5. Themethod of claim 1, wherein the heat generating component comprises anoptical module and wherein the MEMS module and the optical module areremovably inserted into an optical cage module.
 6. The method of claim1, wherein the heat generating component comprises an offload engine atan access point.
 7. An apparatus comprising: a power unit including amicroelectromechanical system (MEMS) module having plurality of airmovement cells configured to cool a heat generating component positionedadjacent to the MEMS module; and a controller coupled to the MEMS moduleand to the heat generating component, wherein the controller isconfigured to: receive an indication of removal of the MEMS module;monitor a temperature at the heat generating component; and modify anoperating mode of the heat generating component upon the temperatureexceeding a predetermined limit.
 8. The apparatus of claim 7, whereinthe indication of removal of the MEMS module comprises input from anonline installation and removal switch.
 9. The apparatus of claim 7,wherein the controller is configured to provide an indication that is itsafe to remove the MEMS module based on the temperature.
 10. Theapparatus of claim 7, wherein the power unit is configured to receivepower and SPE (Single Pair Ethernet).
 11. The apparatus of claim 7,wherein the power unit comprises a pulse width modulation powercontroller operable to individually control one or more of the airmovement cells.
 12. The apparatus of claim 7, wherein the heatgenerating component comprises an optical module and wherein the MEMSmodule and the optical module are removably inserted into an opticalcage module.
 13. The apparatus of claim 7, wherein the heat generatingcomponent comprises an offload engine at an access point.
 14. Theapparatus of claim 7, further comprising a plurality of heat generatingcomponents each of which is positioned adjacent the MEMS module, andwherein the controller is configured to modify an operating mode ofrespective ones of the plurality of heat generating components.
 15. Anapparatus comprising: a power unit including a microelectromechanicalsystem (MEMS) module having plurality of air movement cells configuredto cool a heat generating component positioned adjacent to the MEMSmodule, wherein the power unit further includes a pulse width modulationpower controller operable to individually control one or more of the airmovement cells; and a controller coupled to the MEMS module and to theheat generating component, wherein the controller is configured to:monitor a temperature at the heat generating component; and modify anoperating mode of the heat generating component upon the temperatureexceeding a predetermined limit.
 16. The apparatus of claim 15, whereinthe controller is configured to provide an indication that is it safe toremove the MEMS module based on the temperature.
 17. The apparatus ofclaim 16, wherein the indication of removal of the MEMS module comprisesinput from an online installation and removal switch.
 18. The apparatusof claim 15, wherein the power unit is configured to receive power andSPE (Single Pair Ethernet).
 19. The apparatus of claim 15, wherein theheat generating component comprises an optical module and wherein theMEMS module and the optical module are removably inserted into anoptical cage module.
 20. The apparatus of claim 15, further comprising aplurality of heat generating components each of which is positionedadjacent the MEMS module, and wherein the controller is configured tomodify an operating mode of respective ones of the plurality of heatgenerating components.